Method for producing a plastic container having a planar electronic element, plastic container produced according to said method, and injection mold for carrying out the method

ABSTRACT

In order to produce a plastic container ( 1, 2 ) having a planar electronic element ( 15 ), a planar electronic element ( 15 ) is introduced into a recess ( 29 ) of an inner face of a mold. The mold comprises an outer mold part ( 10 ) and a mold core ( 11 ), which form a mold cavity ( 12 ). Molten plastic material is injected into the mold cavity ( 12 ). After the subsequent cooling of the plastic material, mold removal is carried out. The recess ( 29 ) is arranged on an inner face ( 26 ) of the outer mold part ( 10 ). The molten plastic material is injected into the mold cavity in such a way that the molten plastic material flows substantially parallel along a surface ( 25 ) of the planar electronic element ( 15 ) facing the mold cavity ( 12 ). The planar electronic element ( 15 ) is an RFID inlay, for example. The planar electronic element does not require a protective casing and can be sprayed directly.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a National Stage of International Application No.PCT/CH2011/000103, filed on May 4, 2011, which claims priority fromSwiss Patent Application No. 718/10, filed on May 10, 2010, the contentsof all of which are incorporated herein by reference in their entirety.

The invention pertains to a method for producing a plastic containerhaving a two-dimensionally extending electronic element by introducingthe two-dimensionally extending electronic element into at least onerecess of an inner face of a mold featuring an outer mold part and amold core and forming a mold cavity, as well as injecting a moltenplastic material into the mold cavity of the injection mold andsubsequently cooling the plastic material.

In the prior art, it is known to provide containers with atwo-dimensionally extending electronic element that contains dataconcerning the package and/or the content of the package or can beprovided with such data. This data can be conventionally read in andread out in a contactless fashion. This makes it possible to ensure, inparticular, the originality of the package and/or its content.

It is also known, for example, to provide containers with a barcode thatcontains the corresponding data. The barcode can be optically scanned.However, this has significant disadvantages. Such a barcode can, inparticular, be manipulated in a relatively simple fashion. The opticalscanning of a barcode furthermore cannot be ensured, for example, afterit was subjected to soiling.

If the container is provided with a two-dimensionally extendingelectronic element such as, for example, an RFID tag, the readout ismuch easier and also more secure. For example, an RFID tag may be bondedonto a container. Such an RFID tag may be realized in the form of anRFID inlay. Such RFID inlays respectively have an RFID antenna that isarranged on an antenna foil and on which a chip module with a carrierfoil is fixed. The chip module is preferably situated between the twoaforementioned foils. A bonded REID tag can be detached from thecontainer at any time in a comparatively simple fashion and withoutbeing damaged.

In the prior art, it is also known to produce plastic containers bymeans of injection molding, wherein the two-dimensionally extendingelectronic element is injection-molded onto the container. This allows amore intimate connection between the two-dimensionally extendingelectronic element and the plastic of the container. In the prior art,such a method is disclosed in WO 2008/069846. In this method, an RFIDinlay is accommodated in a plastic housing that forms a protectivecovering and features laterally protruding tabs on its circumference.The plastic housing is fixed in a recess of a mold core of a mold withthese tabs. After the mold has been closed, molten plastic material isinjected into the mold cavity through a nozzle. The plastic material isremoved from the mold after it has cooled. The plastic housing with theRFID inlay accommodated therein is now arranged in the inner face, forexample, on the bottom of the container. The plastic housing isintimately connected to the plastic of the container. This method iscomparatively elaborate because the RFID inlay needs to be accommodatedin the aforementioned plastic housing and this plastic housing thenneeds to be positioned and fixed in a recess of the mold core.

U.S. Pat. No. 7,070,053 discloses a method, in which an RFID tag isinserted into a holding ring that is mounted on the container by meansof bendable tabs thereof. This type of mounting is also comparativelyelaborate. In this case, the RFID tag is connected to the container in acomparatively loose fashion and basically could be detached from thecontainer and manipulated.

The invention is based on the objective of developing a method of theinitially cited type that can be carried out in an even easier and morecost-efficient fashion and makes it possible to produce a particularlysecure container.

In a method of the initially cited type, this objective is attained inthat the recess is arranged on an inner face of the outer mold part andthe molten plastic material is injected into the mold cavity in such away that it flows essentially parallel along a surface of thetwo-dimensionally extending electronic element that faces the moldcavity.

In the region of the recess, the plastic material therefore flowsessentially parallel to the extent of the recess. Experiments have shownthat the two-dimensionally extending electronic element is protectedparticularly well by the molten plastic material in such a recess andalso not damaged or destroyed if it is not accommodated in a housing ora protective covering. The two-dimensionally extending electronicelement, particularly an RFID (Radio Frequency Identification Device)inlay, therefore can be directly introduced into the recess withoutprotective means. During the injection molding process, the moltenplastic material flows along the electronic element, wherein thiselectronic element is held in the recess such that it cannot float away.The stress on the two-dimensionally extending electronic element iscomparatively low because the molten plastic material consequently doesnot impact on the two-dimensionally extending electronic element at anacute angle. It is possible, in particular, to largely prevent anyshearing forces from acting upon the narrow side of thetwo-dimensionally extending electronic element. Since thetwo-dimensionally extending electronic element or the RFID inlayrespectively is directly injection-molded onto the container rather thanin a protective covering, a much more intimate connection between thetwo-dimensionally extending electronic element and the plastic of thecontainer is achieved. Consequently, the two-dimensionally extendingelectronic element injection-molded onto the container can hardly bedetached without being damaged. This provides a very high security, inparticular, with respect to ensuring the originality of the container orits content, respectively.

The inventive method is also suitable for large-scale production. Asmentioned above, it is advantageous that the electronic element does nothave to be accommodated in a protective covering. A correspondingproduction step therefore can be eliminated. Since no protectivecovering is used, the costs can also be lowered accordingly. Althoughthe two-dimensionally extending electronic element consists, inparticular, of an RFID inlay in this case, it would also be conceivableto utilize another electronic element that makes it possible toelectronically read out and read in data in a contactless fashion orread out and read in data via an electric contact. The electronicelement may be active or passive, i.e., it may be provided with orconnected to its own energy source or be realized such that it canreceive energy externally, e.g., from a field. It goes without sayingthat it is also possible to introduce and injection-mold severalelectronic elements into the mold cavity. These electronic elementsessentially may be realized identically or differently. The method isparticularly suitable for producing microtiter plates, cuvettes,so-called cartridges for diagnostic purposes and containers formicrofluidic applications. Such containers make it possible, forexample, to establish so-called libraries for pharmaceutical researchthat contain biological samples over extended storage periods. Theplastic material used basically may consist of any suitablethermoplastic polymer such as, e.g., polypropylene or polycarbonate. Theinventive method makes it possible to produce a container, in which thetwo-dimensionally extending electronic element is arranged on theoutside of the container. Such an electronic element is not subjected tothe content of the container such that it is possible to prevent anycontact that could alter the electronic element and also the content.

According to an enhancement of the invention, it is proposed to injectthe molten plastic material into the mold cavity through a nozzle of theouter mold part. The nozzle, through which the molten plastic materialis injected, therefore is situated in the outer mold part that alsocontains the aforementioned recess. Such an arrangement makes itpossible, in particular, to inject the plastic material in such a waythat it flows along the two-dimensionally extending electronic elementin a particularly gentle fashion. It would naturally also be possible toprovide more than one nozzle, through which the molten plastic materialis injected. The nozzle could, in principle, also be arranged in themold core.

According to an enhancement of the invention, it is proposed to realizethe recess such that it essentially corresponds to the two-dimensionallyextending electronic element. In this way, the two-dimensionallyextending electronic element is, in essence, precisely positionedlaterally. The recess and the two-dimensionally extending electronicelement may be realized, for example, in a circular fashion. However, itwould also be conceivable to use different shapes, wherein the recessand the two-dimensionally extending electronic element may be realizedwith a rectangular shape such as, for example, square.

According to an enhancement of the invention, it is proposed to realizethe recess in the form of an elevation on the inner face of the outermold part. The elevation consists, in particular, of a collar thatsurrounds the inserted two-dimensionally extending electronic element ina protective fashion. The surface of the two-dimensionally extendingelectronic element that faces the mold cavity may protrude over, bearranged flush with or recessed relative to this elevation. Theaforementioned surface preferably is arranged essentially flush with theaforementioned elevation or slightly underneath this elevation. Sincethe two-dimensionally extending electronic element does not require aprotective covering, the height of the two-dimensionally extendingelectronic element may be comparatively small and the elevationaccordingly may have a comparatively small height, for example, fromabout 0.1 mm to about 0.5 mm. The elevation forms a protective wall orbarrier of sorts and prevents the molten plastic material from actingupon the electronic element in a damaging fashion. The elevation doesnot necessarily have to be closed over its circumference, but preferablyis provided at least at the locations, at which the plastic materialflows against the electronic element. In a top view, for example, theelevation could be realized in an approximately U-shaped, sector-shaped,square, rectangular or bar-shaped fashion.

The two-dimensionally extending electronic element consists, inparticular, of a passive electronic element such as, for example, anRFID inlay. Such RFID inlays are generally known and commerciallyavailable. In contrast to the prior art, they can also be introduced andinjection-molded into the mold without a protective covering in theinventive method. The surface that faces the mold cavity consists, inparticular, of a surface of the carrier foil, on which the chip moduleis arranged. In this case, the chip module is situated between thiscarrier foil and the antenna foil. In such a container, the carrier foilis rigidly connected to the plastic of the container. In order toconnect the carrier foil to the container in a particularly rigidfashion, it may be plasma-treated, provided with an intermediate foil orwith an adhesive. In the container produced in accordance with thismethod, the chip module is situated underneath the antenna foil thatforms the outer face. An even superior protection can be ensured with anenhancement of the invention, according to which another plasticcomponent is injected into the mold cavity. After the injection of thefirst component into the mold, another cavity is formed and a secondcomponent is injected therein. In this case, the two-dimensionallyextending electronic element therefore is situated between two injectedcomponents. The two-dimensionally extending electronic element thereforeis situated underneath the second plastic layer that forms the outerface or at least part of the outer face of the container in this case.The two plastic components may consist of identical or differentmaterials.

The invention also pertains to a plastic container produced according tothe inventive method. In this container, the two-dimensionally extendingelectronic element is arranged on the outer face. This provides thesignificant advantage that substances and the like situated in thecontainer cannot have any effect on and therefore cannot damage theelectronic element. Vice versa, the electronic element also cannotaffect the container content, namely not even if the electronic elementor RFID inlay is not arranged in a protective covering. On the outside,the two-dimensionally extending electronic element may be exposed orcovered with at least one other injected plastic component. If thetwo-dimensionally extending electronic element is exposed, for example,it may be arranged flush with the outer face of the container. Asmentioned above, the two-dimensionally extending electronic elementpreferably is directly injection-molded onto the container and thereforenot arranged in a protective covering or the like. For example, thecarrier foil of the chip module is injection-molded on the container andthe antenna foil forms the outer face. Such a two-dimensionallyextending electronic element is arranged, in particular, on a bottom ofthe container such as, for example, on the bottom of a cuvette, amicrotiter plate or a cartridge. The container may be entirely orpartially made of plastic.

The invention also pertains to an injection mold for carrying out theinventive method. The mold of such an injection mold is essentiallyformed by an outer mold part and a mold core. One of these two moldparts usually is stationary and the other mold part is movable. Thetwo-dimensionally extending electronic element may be arranged in thestationary or in the movable mold part. The recess for accommodating thetwo-dimensionally extending electronic element is situated in the outermold part. The outer mold part at least partially forms the outer faceof the container. The mold core, in contrast, at least partially formsthe recess or the recesses of the container.

According to an enhancement of the invention, the recess, into which thetwo-dimensionally extending electronic element is introduced, mayfeature elements for fixing the two-dimensionally extending electronicelement. For example, these elements may consist of snap-in elementssuch as, for example, snap-in tabs. The two-dimensionally extendingelectronic element therefore is snapped into the depression when it isintroduced therein. The snap-in force may be comparatively low. It wouldalso be possible to fix the two-dimensionally extending electronicelement with an adhesive or by means of electrostatic forces. However,it would also be conceivable, for example, to fix the two-dimensionallyextending electronic element with a vacuum. In this case, the recess mayfeature, for example, openings that are connected to a vacuum pump via acorresponding line. The vacuum is neutralized after the molten plastichas cooled.

The recess may be realized in the form of an insert that is insertedinto a corresponding bore of the outer mold part. According to anenhancement of the invention, this insert is exchangeable such that therecess can be easily adapted to different electronic elements. Theinsert may furthermore be movably supported in order to form a cavity inthe outer mold part.

Exemplary embodiments of the invention are described in greater detailbelow with reference to the drawings. In these drawings:

FIG. 1 shows a section through part of an injection mold,

FIG. 2 shows a section through a mold of an injection mold after theinjection of a molten plastic into the mold cavity,

FIG. 3 shows a section through an enlarged part of the mold according toFIG. 2,

FIG. 4 shows a section through a highly enlarged part of the moldaccording to FIG. 1,

FIG. 5 shows a three-dimensional view of a container produced accordingto the inventive method,

FIG. 6 shows a highly enlarged detail of FIG. 5,

FIG. 7 shows a three-dimensional view of the container according to FIG.5,

FIG. 8 shows a view of the underside of the container according to FIG.5, and

FIGS. 9 a-9 f schematically show sections through variations ofelevations that respectively at least partially surround an electronicelement.

The injection mold 8 illustrated in FIG. 1 features a mold 9, in which amold cavity 12 is formed by an outer mold part 10 and a mold core 11. Atleast the outer mold part 10 or the mold core 11 is movable such that aplastic part being produced in the mold cavity 12 can be removed fromthe mold. The mold cavity 12 is only sectionally illustrated in thisfigure and formed by an inner face 26 of the outer mold part 10 and aninner face 28 of the mold core 11. The mold cavity 12 is realized insuch a way that a plastic container 2 according to FIGS. 5 to 8 can beproduced therein. The outer mold part 10 at least partially defines theouter face of the plastic container 2 and the mold core 11 at leastpartially defines the inner face of this container.

The inner face 26 of the outer mold part 10 contains a recess 29, inwhich a two-dimensionally extending electronic element 15 is arranged.The recess 29 is surrounded by an elevation 24 that encompasses therecess 29. The height of this elevation 24 lies, for example, in therange from about 0.1 mm to about 0.5 mm. The elevation may be closedover its circumference although it is also possible to realize anembodiment, in which the elevation 24 is laterally open. The elevation24 has the function of a protective wall or barrier that prevents themolten plastic material flowing into the cavity 12 from damaging thetwo-dimensionally extending electronic element 15. The recess 29 isarranged in such a way that the molten plastic material flowsessentially parallel along the electronic element 15. In FIG. 1, thearrow 23 indicates the direction, in which the molten plastic materialflows along the electronic element 15. The elevation 24 stops theinflowing molten plastic material before it reaches the electronicelement 15 at a lateral surface 30 of the elevation 24. This preventsthe plastic material from entraining the two-dimensionally extendingelectronic element 15 on a narrow side 31 and therefore moving andrendering the two-dimensionally extending electronic elementinoperative. The elevation 24 therefore is arranged, in particular, inthe region indicated with the arrow 23 in FIG. 1. FIGS. 9 a to 9 f showvariations of elevations 24 a to 24 f that are respectively intended fora rectangular electronic element 15′ and a circular electronic element15. The flow direction of the plastic material is indicated with anarrow 35. The elevation 24 a is circumferentially closed while theelevations 24 b and 24 c are laterally interrupted. The elevation 24 dis realized in a bar-shaped fashion and the elevation 24 e is realizedin a U-shaped fashion. The elevation 24 f is realized with a circularshape, but higher in the inflow region than in the remaining region. Anelevated region 36 that evidently faces the inflowing plastic materialis indicated in FIG. 9 f.

The two-dimensionally extending electronic element 15 has a surface 25that faces the cavity 12. The molten plastic material inflowing in thedirection of the arrow 23 covers this surface 25. After the plasticmaterial has cured, it is injection-molded onto the two-dimensionallyextending electronic element 15 on the surface 25. The two-dimensionallyextending electronic element 15 therefore is rigidly connected to theplastic material. The two-dimensionally extending electronic element 15is arranged on the outer face of the respective plastic part orcontainer and, according to FIGS. 5, 7 and 8, surrounded by a recess 34that corresponds to the elevation 24. Two-component or multi-componentinjection molding processes make it possible to cover thetwo-dimensionally extending electronic element 15 with at least onenot-shown additional layer. After the first component has cured, anadditional cavity is formed by moving or exchanging the outer mold part10 and another component is then injected into this additional cavity.In this case, the two-dimensionally extending electronic element 15 isembedded between at least two layers. The two components may consist ofthe same plastic material or of different plastic materials. Such anembedded two-dimensionally extending electronic element 15 isparticularly well protected against environmental influences and alsocannot be removed or damaged.

FIGS. 2 and 3 show an injection mold 8′ for producing a plasticcontainer 1. According to FIG. 3, this plastic container 1 features abottom wall 3 and a side wall 6. These walls 3 and 6 form severalrecesses 5 that serve, for example, for accommodating not-shownsubstances, samples and the like. The container 1 may be provided with anot-shown cover or lid. The bottom wall 3 has an underside 4, on which atwo-dimensionally extending electronic element 15 is arranged. FIGS. 2and 3 show the plastic container 1 after the curing of the plasticmaterial, but before the removal from the mold.

The recess 29′, into which the two-dimensionally extending electronicelement 15 is introduced, is formed by an insert 14 of the outer moldpart 10′. The elevation 24′ therefore forms part of the insert 14. Theinsert 14 can be exchangeable and be made of a different material thanthe remainder of the outer mold part 10′. However, the insert 14 is notabsolutely necessary. The mold 9′ also consists of the mold core 11′ andthe outer mold part 10′ in this case. The molten plastic material isinjected into the mold cavity 12′ through a nozzle 13. The flowdirection of the molten material in the nozzle 13 is indicated with thearrow 27. The flow direction is deflected by about 90° in the region ofthe cavity 12′, in which the bottom wall 3 is produced. The flowdirection therefore extends at an angle of about 90° to the direction ofthe arrow 27 in the region of the two-dimensionally extending electronicelement 15. Consequently, the molten plastic material also flowsessentially parallel to the plane of the two-dimensionally extendingelectronic element 15 in this case. The pressure of the molten plasticmaterial in the cavity 12′ lies, for example, in the range between 150and 450 bar. The temperature of the molten plastic material in thecavity 12′ lies, for example, in the range between 180° and 350° C. Dueto the aforementioned flow direction in the region of thetwo-dimensionally extending electronic element 15, essentially noshearing forces act upon the narrow side 31 of the two-dimensionallyextending electronic element 15. The electronic element therefore is notdamaged and/or moved from its position by the inflowing plasticmaterial. The two-dimensionally extending electronic element 15therefore is not directly acted upon by the molten plastic material suchthat the risk of damages is significantly reduced.

The two-dimensionally extending electronic element 15 consists, forexample, of an RFID inlay with a chip 19 or a chip module that merely isschematically indicated in FIG. 4 and arranged between an antenna foil16 and a carrier foil 18. An antenna 17 that is electrically connectedto the chip 19 is conventionally arranged on the antenna foil 16. Thechip 19 forms an elevation referred to the surface 25. This elevationprotrudes into the mold cavity 12. In FIG. 4, this cavity 12 is not yetfilled with the molten plastic material. During the injection of themolten plastic material, it flows in the direction of the arrow 32 andtherefore essentially parallel to the plane of the two-dimensionallyextending electronic element 15. The elevation 24′ is not illustrated inFIG. 4. This elevation preferably also protrudes over the elevationformed by the chip 19. However, the chip 19 may also protrude over theelevation 24′.

The two-dimensionally extending electronic element 15 may be looselyintroduced into the respective recess 29 or 29′. The respective recess29 or 29′ preferably is realized such that it essentially corresponds tothe two-dimensionally extending electronic element 15. However, thetwo-dimensionally extending electronic element 15 may also be fixed inthe respective recess 29 or 29′. This fixing of the two-dimensionallyextending electronic element 15 could conceivably be realized with aclamping arrangement or with adhesion, for example, by means of anadhesive or by means of a vacuum. The insert 14 may be provided, forexample, with not-shown bores, by means of which a vacuum can be appliedto the underside of the two-dimensionally extending electronic element15.

An increased adhesion of the two-dimensionally extending electronicelement 15 on the plastic material can be achieved, for example, byroughening or otherwise treating the surface 25 with a plasma treatment.It is also possible to utilize an intermediate foil that is placed ontothe surface 25. Due to such an improved adhesion, it is even moredifficult to separate the two-dimensionally extending electronic element15 from the container 1 without damages.

In the exemplary embodiments shown, the respective recess 29 or 29′ isformed by a respective elevation 24 or 24′. However, it would also beconceivable to realize an embodiment, in which no such elevation 24 or24′ is provided. In this case, the respective recess 29 or 29′ thereforeis a recess in an essentially plane surface of the respective outer moldpart 10 or 10′. However, the recess is in this case also arranged insuch a way that the molten plastic material flowing into the cavity 12flows essentially parallel over the two-dimensionally extendingelectronic element 15. The two-dimensionally extending electronicelement 15 may be directly injection-molded onto the container without aprotective covering. Since the molten plastic material does not directlyflow against or act upon the two-dimensionally extending electronicelement, it can be directly injection-molded onto the surface 25 andalso onto an outer surface 33 without a protective covering. The insert14 may be realized in a movable fashion in order to inject plasticmaterial onto the outer surface 33. In this case, a movement of theinsert 14 makes it possible to form a not-shown cavity, into whichanother molten plastic material can be injected. This additional plasticmaterial then forms a layer that is injected onto the outer surface 33.This layer 37 is indicated with a broken line in FIG. 6 and may beopaque such that the two-dimensionally extending electronic element 15is not visible on the plastic container 1. However, this layer 37 couldalso be transparent. The nozzle for injecting this plastic material maybe arranged in the insert 14. The second plastic component is theninjected through this not-shown nozzle. The second plastic component mayalso consist of any suitable thermoplastic polymer such as, for example,polypropylene or polycarbonate.

The container 2 illustrated in FIGS. 5 to 8 features a recess 21, forexample, for accommodating samples. A laterally protruding collar 22 maybe provided in order to attach a not shown lid or another cover. Theelectronic element 15 is evidently arranged on the outer side of abottom wall 20 and may contain data concerning the samples stored in thecontainer 2 and/or data concerning the container 2, as well as otherdata and information.

This data can be read and input with a suitable device in a contactlessfashion and/or via a not shown electric contact. Since the electronicelement 15 is arranged on the underside of the bottom wall 20 andtherefore not in the recess 21, it is separated from the samples,substances and the like stored in the recess 21 by the bottom wall 20such that a mutual chemical or physical influence can be largelyprecluded. Depending on the design of the elevation 24, thegroove-shaped recess 34 completely or only partially surrounds theelectronic element 15. It may be filled within injected plasticcomponent or another applied layer. The surface 33 of the antenna foil16 may be recessed into, protrude from or arranged flush with the outerface of a bottom wall. It may be exposed or, as mentioned above, also bearranged underneath a not-shown layer.

LIST OF REFERENCE SYMBOLS

-   1 Plastic container-   2 Plastic container-   3 Bottom wall-   4 Underside-   5 Recesses-   6 Side wall-   8 Injection mold-   9 Mold-   10 Outer mold part-   11 Mold core-   12 Mold cavity-   13 Nozzle-   14 Insert-   15 Electronic element-   16 Antenna foil-   17 Antenna-   18 Carrier foil-   19 Chip-   20 Bottom wall-   21 Recess-   22 Collar-   23 Arrow-   24 Elevation-   25 Surface-   26 Inner face-   27 Arrow-   28 Inner face-   29 Recess-   30 Lateral surface-   31 Narrow side-   32 Arrow-   33 Surface-   34 Recess-   35 Arrow-   36 Elevated region-   37 Layer

The invention claimed is:
 1. A method for producing a plastic containerhaving a two-dimensionally extending electronic element in the form ofan RFID inlay, the method comprising at least the following steps: a.)providing a two-dimensionally extending RFID inlay being realizedwithout a protective covering, a mold and a first plastic component inthe form of a molten plastic material, wherein the mold features anouter mold part with a first inner face and a mold core with a secondinner face, said first and said second inner face together forming amold cavity, wherein the outer mold part comprises a recess being formedby a collar-shaped elevation of the first inner face, and wherein therecess is realized such that it corresponds to the two-dimensionallyextending RFID inlay, in order to be able to position the RFID inlaylaterally precisely within the recess; b.) introducing thetwo-dimensionally extending RFID inlay without a protective coveringinto the recess of the mold; c.) injecting the first plastic componentinto the mold cavity of the mold and onto the two-dimensionallyextending RFID inlay; and d.) subsequently to step c.), cooling thefirst plastic component.
 2. The method according to claim 1, wherein thefirst plastic component is injected into the mold cavity through anozzle of the outer mold part.
 3. The method according to claim 1,wherein the two-dimensionally extending RFID inlay is a passiveelectronic element.
 4. The method according to claim 1, wherein at leastone second plastic component is injected into the mold cavity.
 5. Aplastic container comprising a wall formed by plastic material, and atwo-dimensionally extending electronic element in the form of an RFIDinlay being arranged in or on the wall, wherein the plastic container isproduced according to a method comprising at least the following steps:a.) providing a two-dimensionally extending RFID inlay being realizedwithout a protective covering, a mold and a first plastic component inthe form of a molten plastic material, wherein the mold features anouter mold part with a first inner face and a mold core with a secondinner face, said first and said second inner face together forming amold cavity, wherein the outer mold part comprises a recess being formedby a collar-shaped elevation of the first inner face, and wherein therecess is realized such that it corresponds to the two-dimensionallyextending RFID inlay, in order to be able to position the RFID inlaylaterally precisely within the recess; b.) introducing thetwo-dimensionally extending RFID inlay without a protective coveringinto the recess of the mold; c.) injecting the first plastic componentinto the mold cavity of the mold and onto the two-dimensionallyextending RFID inlay; and d.) subsequently to step c.), cooling thefirst plastic component.
 6. The plastic container according to claim 5,wherein the two-dimensionally extending RFID inlay is arrangedessentially flush with an outer face of the wall.
 7. The plasticcontainer according to claim 5, wherein the two-dimensionally extendingRFID inlay is embedded between two layers that at least partially formthe wall.
 8. The plastic container according to claim 7, wherein thetwo-dimensionally extending RFID inlay is embedded between two layersthat at least partially form a bottom wall.
 9. The plastic containeraccording to claim 5, wherein it is a cuvette, a microtiter plate or acartridge.
 10. An injection mold comprising an outer mold part having afirst inner face, which features a recess being formed by acollar-shaped elevation of the first inner face for accommodating andlaterally precisely positioning a two-dimensionally extending electronicelement in the form of an RFID inlay being realized without a protectivecovering, and a mold core having a second inner face, a mold cavityformed by said first inner face and said second inner face together, anda nozzle for injecting molten plastic material into the mold cavity andonto the two-dimensionally extending RFID inlay accommodated in therecess.
 11. The injection mold according to claim 10, wherein the recessis formed by an elevation that protrudes from the inner face of theouter mold part.
 12. The injection mold according to claim 10, whereinthe nozzle is arranged in the outer mold part.
 13. The injection moldaccording to claim 10, wherein the recess features elements for fixingthe two-dimensionally extending RFID inlay.